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Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging

04/30/2025 | Real Time with...IPC APEX EXPO
In a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.

TMEIC Breaks Ground on Third Manufacturing Facility in Texas

04/29/2025 | TMEIC
TMEIC Corporation Americas, a subsidiary of TMEIC Corporation (Japan), proudly announces the groundbreaking of its third U.S. manufacturing facility, located in Waller County, Texas.

Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips

12/23/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Bell Announces New Manufacturing Facility for the U.S. Army’s Future Long Range Assault Aircraft

12/18/2024 | Bell
Bell Textron Inc., a Textron Inc. company, announced a facility site selection today to support production of the U.S. Army’s Future Long Range Assault Aircraft (FLRAA). The new 447,000 sq. ft. factory, located in the Denton County region of Fort Worth, Texas, will be dedicated to FLRAA component manufacturing.  Bell plans to begin facility modification and equipment installation and achieve facility readiness for Low-Rate Initial Production (LRIP) by 2028.

Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers

12/18/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC LLC (MEMC), subsidiaries of GlobalWafers Co., Ltd. (GlobalWafers), of up to $406 million under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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