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I-Connect007 has released Episode 5 of its forward-thinking podcast series on one of the most critical innovations shaping the future of electronics manufacturing: Ultra High Density Interconnect (UHDI) technology.
In “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
Across the UHDI series, listeners gain an insider’s view of this transformative technology through expert interviews, real-world examples, and actionable insights. Each episode is paired with downloadable resources to help professionals apply what they’ve learned directly to their work.
The On the Line with… American Standard Circuits: Ultra HDI podcast series is available now on the I-Connect007 platform and all major podcast directories.
Listen to Episode 5 here.
