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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

TECO, Foxconn Showcase NVIDIA-Based Modular Data Center

11/02/2026 | Foxconn
Teco Electric participated in Foxconn Technology Day for the second time, focusing on its Modular Data Center (MDC ) concept developed in cooperation with Foxconn. The MDC is based on the NVIDIA DSX POD reference design.

Intel to Acquire Classiq to Create a Full-stack Quantum Computing Platform

10/28/2026 | Intel
 Intel Corporation announced that it has entered into a definitive agreement to acquire Classiq, a leading provider of quantum computing software. The combination of Classiq’s synthesis platform with Intel’s spin-qubit manufacturing and existing software would create a user-friendly full-stack quantum computing platform, enabling the promising technology to mature into a mainstream computing business.

Compal, ARC Cloud Forge Strategic Partnership to Accelerate Large-Scale AI Infrastructure

10/27/2026 | PRNewswire
Compal Electronics, Inc. and ARC Cloud announced the signing of a Memorandum of Understanding (MOU) to advance their strategic collaboration in large-scale AI computing infrastructure.

Global EMS Market to Grow by $202.7 Billion Through 2030

10/26/2026 | Globe Newswire
Cadence announced the Maestro AI Model Portfolio, which powers Cadence® AI Super Agents across semiconductor and system design workflows.

qBraid Announces qBraid OS for Operating Quantum Computing Services

10/23/2026 | PRNewswire
qBraid introduced qBraid OS, software that quantum hardware providers and system operators can use to run their systems and make them available to users, whether as a commercial service or for internal use.
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