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Jabil Recognizes Nordson Electronics Solutions with the 2024 Best Strategic Supplier Award

02/05/2025 | Nordson Corporation
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, has been honored with the 2024 Jabil Best Strategic Supplier Award, underscoring Nordson’s essential role in enabling Jabil, a global leader in manufacturing services, to achieve operational excellence and deliver exceptional value across its supply chain.

RTX's Collins Aerospace Awarded Cooperative Engagement Capability Design Agent Contract from U.S. Navy

02/04/2025 | RTX
Collins Aerospace, an RTX business, was awarded a follow-on contract with a potential for up to $904 million over five years to continue development of the U.S. Navy's Cooperative Engagement Capability, a system that integrates sensors across surface, land, and air platforms to enable Integrated Fire Controls.

ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at IPC APEX

02/04/2025 | ITW EAE
ITW EAE will be showcasing its latest developments at IPC APEX, March 18 - 20 in Anaheim. The ITW EAE booth #2400 will have MPM, Camalot, Electrovert, Vitronics Soltec and Despatch Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

Swissbit Unveils PCIe Gen4 SSD A1200

02/04/2025 | Swissbit
Swissbit introduces the latest addition to its PCIe portfolio, the new A1200. The PCIe Gen4 M.2 SSD is designed to meet the demands of high-performance, mission-critical applications, focusing on consistent performance, low latency, and data integrity.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
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