Imec, Partners Unveil SWIR Sensor with Lead-free Quantum Dot Photodiodes
December 31, 2024 | ImecEstimated reading time: 2 minutes
At the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and its partners in the Belgian project Q-COMIRSE, present a first of its kind prototype shortwave infrared image sensor with indium arsenide quantum dot photodiodes. The sensor demonstrated successful 1390 nm imaging results, offering an environmentally friendly alternative to first-generation quantum dots that contain lead, which limited their widespread manufacturing. The proof-of-concept is a critical step toward mass-market infrared imaging with low-cost and non-toxic photodiodes.
By detecting wavelengths beyond the visible spectrum, shortwave infrared (SWIR) sensors can provide enhanced contrast and detail, as materials reflect differently in this range. These sensors can distinguish objects that appear identical to the human eye and penetrate through fog or mist, making them invaluable for applications such as face recognition or eye tracking in consumer electronics, and autonomous vehicle navigation. While current versions are costly and limited to high-end applications, wafer-level integration promises broader accessibility.
Quantum dots (QDs) are nanoscale semiconductor particles that can be engineered to emit and absorb light at specific wavelengths. Tuned for SWIR, they offer compact, low-cost absorbers, since integration into CMOS circuits and existing manufacturing processes is possible. However, first-generation QDs often contain toxic heavy metals such as lead and mercury, and the search for alternatives continues.
At 2024 IEDM, imec and its partners within the Q-COMIRSE project (Ghent University, QustomDot BV, ChemStream BV and ams OSRAM) introduced a SWIR image sensor featuring a lead-free quantum dot alternative as absorber; indium arsenide (InAs). The proof-of-concept sensor, tested on both glass and silicon substrates, was the first of its kind to produce successful 1390 nm imaging results. While QDs are considered fragile in nature, careful selection of stack materials resulted in >300 hour air-stability, enabling fab manufacturing compatibility. The pixel architecture can readily be integrated with CMOS technology for image sensing applications, but also allows flat panel display integration.
Pawel Malinowski, imec technology manager and domain lead imaging, emphasized the significance of this breakthrough: "The first generation of QD sensors was crucial for showcasing the possibilities of this flexible platform. We are now working towards a second generation that will serve as a crucial enabler for the masses - aiming at cost-efficient manufacturing in an environmentally friendly way. With major industry players looking into quantum dots, we are committed to further refine this semiconductor technology towards accessible, compact, multifunctional image sensors with new functionalities."
Stefano Guerrieri, Engineering Fellow at ams OSRAM, added: "Replacing lead in colloidal quantum dots with a more environmentally friendly material was our key goal in Q-COMIRSE. Our remarkable development work with Flemish partners imec, Ghent University, QustomDot and ChemStream paves the way toward a low-cost and Pb-free short-wave-infrared technology that, once mature for industrial products, could enable unprecedented applications in robotics, automotive, AR/VR and consumer electronics among others."
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.
TTM Technologies, Inc. Announces Retirement Plans of its CEO and Proceeds with CEO Successor Search
08/04/2025 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (“PCB”), today announced that Thomas T. Edman, the company’s President and Chief Executive Officer, intends to retire following the appointment of the company’s next President and CEO.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.