Happy’s Tech Talk #37: New Ultra HDI Materials
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AGC Multi Material to Showcase Substrate Materials at DesignCon 2025
December 31, 2024 | AGC Multi Material AmericaEstimated reading time: Less than a minute
AGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, California, Jan. 28-30, 2025.
Visit us at Booth 1238 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise build-up materials, N7000-3F toughened polyimide, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series.
DesignCon is the premier high-speed communications and system design conference and exposition.
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Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
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