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New Fil Arzola Class: Designing for the Future, and for Sustainability

10/07/2025 | Andy Shaughnessy, I-Connect007
If you have not yet taken a class from Fil Arzola, you are missing out. In late October, Fil will be teaching the class "Building Sustainable Model-Based PCBs," speaking from the design perspective. I had the pleasure of catching this course at last year's IPC APEX EXPO, and I walked away with a lot to think about. I asked Fil to discuss his upcoming course. Registration is open now.

Armstrong Asia Signs MOU with Checkmate Capital Group to Explore Strategic Collaboration

09/15/2025 | GlobeNewswire
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Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging

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Direct metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.

Jeh Aerospace Raises $11M to Boost Aircraft Supply Chain

08/12/2025 | I-Connect007 Editorial Team
Jeh Aerospace, the high-precision aerospace and defense manufacturing startup founded by Vishal Sanghavi and Venkatesh Mudragalla, has raised $11 million in a Series A round led by Elevation Capital, with support from General Catalyst, to scale its commercial aircraft supply chain manufacturing in India, according to OEM.

LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.

07/31/2025 | PR Newswire
LQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
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