Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Nano Dimension Announces CEO Transition
January 2, 2025 | Globe NewswireEstimated reading time: Less than a minute
Nano Dimension Ltd., a supplier of Digital Manufacturing solutions, announced that the board of directors has appointed Mr. Julien Lederman as Interim Chief Executive Officer (CEO) of the Company. Yoav Stern’s role as CEO has been terminated, effective immediately. The Board is conducting a comprehensive search for a permanent CEO.
Julien Lederman, who has served as Vice President of Corporate Development since March 2021 will serve as Interim CEO. Previously, Lederman was employed at Amazon.com, Inc., The Goldman Sachs Group, Inc., Lehman Brothers Holdings, Inc., and the World Economic Forum. He earned an MBA from INSEAD in France in 2013 and a BA from Colgate University in New York in 2008.
Yoav Stern had been serving as CEO and a member of the Board since January 2020. As previously announced, at the Company’s 2024 annual general meeting of shareholders, dated December 6, 2024, Stern was not re-elected as a director.
Ofir Baharav, Chairman of the Board, commented: “The Board is pleased and confident in our appointment of Julien Lederman as Interim Chief Executive Officer. The Board fully supports Julien during this transition period while we conduct a broad search for a permanent Chief Executive Officer.”
Share on:
Suggested Items
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
North American PCB Industry Sales Up 21.4% in May
06/20/2025 | IPCIPC announced the May 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.
Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.