-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Nano Dimension Announces CEO Transition
January 2, 2025 | Globe NewswireEstimated reading time: Less than a minute

Nano Dimension Ltd., a supplier of Digital Manufacturing solutions, announced that the board of directors has appointed Mr. Julien Lederman as Interim Chief Executive Officer (CEO) of the Company. Yoav Stern’s role as CEO has been terminated, effective immediately. The Board is conducting a comprehensive search for a permanent CEO.
Julien Lederman, who has served as Vice President of Corporate Development since March 2021 will serve as Interim CEO. Previously, Lederman was employed at Amazon.com, Inc., The Goldman Sachs Group, Inc., Lehman Brothers Holdings, Inc., and the World Economic Forum. He earned an MBA from INSEAD in France in 2013 and a BA from Colgate University in New York in 2008.
Yoav Stern had been serving as CEO and a member of the Board since January 2020. As previously announced, at the Company’s 2024 annual general meeting of shareholders, dated December 6, 2024, Stern was not re-elected as a director.
Ofir Baharav, Chairman of the Board, commented: “The Board is pleased and confident in our appointment of Julien Lederman as Interim Chief Executive Officer. The Board fully supports Julien during this transition period while we conduct a broad search for a permanent Chief Executive Officer.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.