-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Tata Elxsi to Accelerate SDV Adoption With Qualcomm's Snapdragon Automotive Platforms
January 3, 2025 | PRNewswireEstimated reading time: 1 minute
Tata Elxsi, Inc. has announced its plans to work with Qualcomm Technologies, Inc. to develop and leverage virtual models of Snapdragon® Digital Chassis™ solutions for cloud-native application development. Through the intended technology collaboration, which will be demonstrated at the Consumer Electronics Show (CES) 2025, Tata Elxsi will develop a virtual electronic control unit (ECU) platform for automakers and Tier-1 suppliers using Snapdragon virtual system-on-chips (VSoCs) for the next generation of mobility solutions for passenger, commercial, and off-highway vehicle segments.
Tata Elxsi aims to utilize the Snapdragon Digital Chassis VSoCs to help revolutionize the Software-Defined Vehicle (SDV) development process, enabling R&D teams to accelerate software development and validation. By reducing the dependency on hardware availability, this initiative aims to streamline and speed up product development lifecycles, ensuring that advanced mobility solutions reach the market faster and more efficiently.
At CES 2025, Tata Elxsi will showcase this process using the company's AVENIR™ SDV suite of solutions integrated with Qualcomm Technologies' Snapdragon Ride™ Flex SoC. The demonstration will highlight real-world use cases, including mixed-critical workloads for infotainment and advanced driver assistance systems.
"Our planned work with Qualcomm Technologies reflects Tata Elxsi's leadership and investments in SDV technologies and the future of cloud-native automotive software development. Tata Elxsi's AVENIR suite with Snapdragon Digital Chassis solutions offer a high performance, scalable solution for automakers to realize next generation of SDVs. This unique combination of world-class software and system expertise, virtualised models and ready-to-adopt SDV software offers OEMs a compelling and future-ready path to SDVs and next generation mobility," said Shaju S, Vice President & Head of Transportation Business Unit, Tata Elxsi.
"Tata Elxsi's demonstration of enabling Snapdragon virtual SoCs for early development in a cloud-native environment leveraging their AVENIR SDV suite offers the developer community a cost effective, early access to target hardware and reduces time to market for new application development. Access to leading edge, high performance heterogeneous compute environment in the cloud truly enables the future of pre-and post-production approaches to software development. It also facilitates continuous updates of new features throughout the lifecycle of the vehicle, enabling our partners to deliver a rich experience to the end consumer and build new business models," said Laxmi Rayapudi, VP of Automotive Software Product Management, Qualcomm Technologies, Inc.
Suggested Items
SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment
01/07/2025 | PRNewswireSparkFun Electronics, a leader in open-source embedded electronics, and Digi International ®, a leading global provider of complete end-to-end Internet of Things (IoT) connectivity products, solutions and services, announce the launch of a collaborative new development board, the SparkFun IoT Node for LoRaWAN®, as well as two kits, one each for North America and Europe, the SparkFun Digi X-ON™ Kit for LoRaWAN®
Siemens Launches New Program to Empower Startups with Cutting-edge Technology
01/07/2025 | SiemensSiemens launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups.
Biden-Harris Administration Awards SRC $285M for New CHIPS Manufacturing USA Institute for Digital Twins
01/07/2025 | U.S. Department of CommerceThe U.S. Department of Commerce announced that CHIPS for America awarded the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) $285 million to establish and operate a CHIPS Manufacturing USA institute headquartered in Durham, North Carolina.
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
01/07/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging.
The Test Connection, Inc. Celebrates 45 Years of Excellence in Test Engineering Solutions
01/06/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, proudly marks its 45th anniversary in 2025, celebrating decades of delivering high-quality test engineering solutions to the electronics industry. Founded in 1980 by Bill Horner, TTCI emerged as a pioneer in response to the increasing demand for outsourced test engineering products and services. Since its inception, the company has built a legacy of innovation, technical expertise, and world-class customer service.