Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IBM Power11 Raises the Bar for Enterprise IT

07/10/2025 | IBM
IBM revealed IBM Power11, the next generation of IBM® Power® servers. Redesigned with innovations across its processor, hardware architecture, and virtualization software stack, Power11 is designed to deliver the availability, resiliency, performance, and scalability enterprises demand, for seamless hybrid deployment on-premises or in IBM Cloud.

Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)

07/10/2025 | Infineon
As the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.

Maxar Awarded Contract by NGA to Deliver Ai-Powered Object Detection Services

07/01/2025 | Maxar
Maxar Intelligence, the leading provider of secure, precise geospatial insights, announced that it was awarded Delivery Order 01 under the Luno A program by the National Geospatial-Intelligence Agency (NGA).

Empower Appoints Steve Hertog as Senior Vice President of Sales to Strengthen Next Phase of High Growth

07/01/2025 | Empower Semiconductor
Empower Semiconductor, the world leader in integrated voltage regulators (IVRs), announced the appointment of Steve Hertog as Senior Vice President of Sales. In this role,

OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

06/21/2025 | BUSINESS WIRE
OKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in