Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

UHDI Fundamentals: UHDI Technology and Industry 4.0

09/03/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.

UHDI Fundamentals: UHDI Technology and Industry 4.0

08/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.

TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS

07/18/2025 | TT Electronics
TT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant new contract with long-standing customer Ultra PCS Ltd (Ultra Precision Control Systems).

TRI Unveils New Platform for Diverse Board Sizes

07/14/2025 | TRI
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.

The Death of the Microsection

06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.
I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in