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Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values

01/08/2025 | Bob Duke -- Column: Global Sourcing Spotlight
When people want to buy industry products, they often look at a list of products: PCBs, PCBAs, injection molding, batteries, and transformers. However, if you bypass brick-and-mortar facilities, you can usually find better-value products if you search the globe. This is especially true with B2B products. With the right strategy and a keen eye for quality, companies can uncover opportunities to source essential industrial products from offshore suppliers at competitive prices. Here’s a list of some of those products and where to source them.

Hon Hai Research Institute Publishes AI-Driven Silicon Carbide Technology in IEEE OJPEL

01/01/2025 | Hon Hai Technology Group
Hon Hai Technology Group announced that its Semiconductor Research Institute has successfully combined AI learning models with reinforcement learning to accelerate the research and development of silicon carbide power semiconductors.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5

12/23/2024 | I-Connect007 Editorial Team
Chapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.

VDL to Produce Crucial Components for New Medical Isotope Reactor

12/18/2024 | VDL Groep
VDL Groep is working to further broaden and strengthen its hightech activities. The industrial family business with its headquarters in Brainport Eindhoven is taking its first, substantial steps into the nuclear sector, a key growth market. Operating company VDL KTI in Mol, Belgium, will produce and supply crucial components for the new PALLAS reactor in Petten.

Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
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