Hot Off the Press: Explore the New Issue of IPC Community
January 14, 2025 | IPC Community Editorial TeamEstimated reading time: 1 minute

The latest digital copy of IPC Community is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members.
What’s in this issue?
Tariff Troubles: What could a new U.S. administration’s tousle with tariffs mean for your business? IPC Chief Economist Shawn DuBravac lays out the scenario.
Student Leadership: Waad Tarman finishes up her term as the Student Board Member. Find out why the future of electronics is in good hands. (Bonus Video: Hear from two of IPC’s Emerging Engineers, who talk about their path into the industry.)
Women in Business: Barbara Pauls and Siti Wahab show that determination and ingenuity—and a belief in yourself—are enough to overcome any challenge. Get takeaways you can implement in your own pursuit of excellence.
Pure Gold: What would IPC be without its A-Teams? Join us as we go behind the scenes of the 2024 Golden Gnome Awards. You’ll meet the IPC tech team who puts this event all together, and find out what makes it so special.
Dynamic Duo: Brian Chislea of Dow and AJ Arriaga of Summit Interconnect embark on a journey of discovery and growth in IPC’s mentorship program.
Around the World: Read features on two of IPC Asia’s biggest trade shows, how China is developing future engineers, an India wire harness company making waves, IPC’s newest sustainability expert Diana Radovan, a review of electronica 2024, sustainability practices, apprenticeships, and so much more.
Suggested Items
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
04/28/2025 | PRNewswireNEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
04/28/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ITRI Named a Top 100 Global Innovator for the Ninth Time
04/28/2025 | PRNewswireThe Industrial Technology Research Institute (ITRI) was officially honored at the 2025 Top 100 Global Innovators Award Ceremony hosted by Clarivate in Taipei.
Airbus Signs Definitive Agreement with Spirit AeroSystems
04/28/2025 | AirbusAirbus SE has entered into a definitive agreement with Spirit AeroSystems for the acquisition of industrial assets dedicated to its commercial aircraft programmes.