Hot Off the Press: Explore the New Issue of IPC Community
January 14, 2025 | IPC Community Editorial TeamEstimated reading time: 1 minute

The latest digital copy of IPC Community is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members.
What’s in this issue?
Tariff Troubles: What could a new U.S. administration’s tousle with tariffs mean for your business? IPC Chief Economist Shawn DuBravac lays out the scenario.
Student Leadership: Waad Tarman finishes up her term as the Student Board Member. Find out why the future of electronics is in good hands. (Bonus Video: Hear from two of IPC’s Emerging Engineers, who talk about their path into the industry.)
Women in Business: Barbara Pauls and Siti Wahab show that determination and ingenuity—and a belief in yourself—are enough to overcome any challenge. Get takeaways you can implement in your own pursuit of excellence.
Pure Gold: What would IPC be without its A-Teams? Join us as we go behind the scenes of the 2024 Golden Gnome Awards. You’ll meet the IPC tech team who puts this event all together, and find out what makes it so special.
Dynamic Duo: Brian Chislea of Dow and AJ Arriaga of Summit Interconnect embark on a journey of discovery and growth in IPC’s mentorship program.
Around the World: Read features on two of IPC Asia’s biggest trade shows, how China is developing future engineers, an India wire harness company making waves, IPC’s newest sustainability expert Diana Radovan, a review of electronica 2024, sustainability practices, apprenticeships, and so much more.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.