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January 16, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.
The presentation, High Reliability and Low-Temperature Solder Solutions for AI and Automotive Application, will explore cutting-edge solder solutions designed to meet the demanding requirements of the evolving automotive and AI industries. Modern automotive electronics require robust solder solutions that can withstand extreme temperatures while maintaining long-term reliability. Meanwhile, AI applications demand solders compatible with High-Performance Computing (HPC) requirements, where thermal management during processing is critical.
Additionally, Chou will discuss Indium Corporation's innovative Durafuse® LT and Durafuse® HR solder technologies. These solutions address two critical industry challenges: the need for high-reliability solder joints in high-temperature automotive environments and low-temperature processing solutions for complex AI computing modules.
“As the automotive and AI industries continue to push the boundaries of electronic performance, traditional solder solutions are no longer sufficient,” said Chou. “Durafuse® technology represents a significant breakthrough, offering solutions that handle both the intense heat of automotive applications and the precise, low-temperature requirements of AI processing.”
Chou is Indium Corporation’s senior area technical manager for the company’s customers in Taiwan, with a focus on the semiconductor industry. His strategic location in southern Taiwan provides timely customer response, as well as efficient sales and marketing team support. Chou has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology.
Chou earned a master’s degree in chemistry from National Tsing Hua University and a bachelor’s degree in chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
Visitors can view the presentation on Thursday, January 23, at 3:00 p.m. in East Hall 7.
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