Defense Speak Interpreted: It’s Time for a ‘Defense-Speak’ Update
Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
American Made Advocacy: New Congress, New Opportunities
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
January 16, 2025 | TopLine CorporationEstimated reading time: Less than a minute
TopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
MRQW provides a forum for discussing issues in all areas of microelectronics reliability and qualification for high-reliability and commercial applications. TopLine recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers and next generation applications including Very Large 2.5D Packages. The Microelectronics Reliability and Qualification Workshop (MRQW) won the topic, which will be addressed by Hart, including the application of braided solder columns to aerospace applications and extreme environments.
Share on:
Suggested Items
DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI
03/19/2025 | DuPontDuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.
Incap Slovakia Upgrades PCBA Cleaning Technology
03/18/2025 | IncapAt Incap Slovakia, maintaining high product quality requires continuous improvement in PCBA cleaning processes. Our new PCBA washing system is now fully operational, bringing enhanced cleaning performance, increased automation, and improved sustainability to our production.
Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025
03/14/2025 | Ventec International GroupVentec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.
Cybord Unveils AI-Powered Real-Time Interception (RTI) Solution to Prevent Defective Electronic Products
03/14/2025 | PRNewswireCybord, the leading provider of advanced AI-powered electronic component analytics, announced the launch of its Real-Time Interception (RTI) solution, an advanced visual AI-powered software that prevents defective components from being assembled onto Printed Circuit Board Assemblies (PCBAs) in real time.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.