Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
DuPont Reaffirms Guidance, Accelerates Electronics Spin-off
January 16, 2025 | PRNewswireEstimated reading time: 1 minute
DuPont announced the acceleration of the separation of its Electronics business and is now targeting November 1, 2025 to complete the transaction. This decision recognizes the size and importance of Electronics to the overall shareholder value creation opportunity and DuPont's desire to complete the separation as quickly as possible.
Additionally, DuPont no longer intends to separate its Water business. The company evaluated all strategic alternatives and concluded the best path to generate value is for the Water business to remain in the DuPont portfolio. This also enhances DuPont's ability to continue optimizing its portfolio following the Electronics separation.
"We remain confident in the opportunity to create significant shareholder value through the separation of the Electronics business," said Ed Breen, DuPont Executive Chairman. "Achieving an independent Electronics company as soon as possible is the right decision for our shareholders."
"We remain excited about the value creation opportunity for DuPont following the Electronics separation," added Lori Koch, DuPont Chief Executive Officer. "The decision for Water to remain with DuPont provides the new organization with greater strategic flexibility over time and another high growth business alongside Healthcare. We continue to have conviction in the attractive outlook for Water and expect 2025 to be a strong year for the business."
Reaffirms Fourth Quarter and Full Year 2024 Financial Outlook
DuPont reaffirms its fourth quarter and full year 2024 financial guidance for net sales, operating EBITDA and adjusted EPS as provided on November 5, 2024 as part of its third quarter earnings release, including the expected continued improved performance in Water.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.