Peters Leverages Inkjet Technology to Optimize PCB Manufacturing
January 17, 2025 | PetersEstimated reading time: 2 minutes

Peters has put the second SUSS LP50 ‘Pixdro’ inkjet printer into operation. This machine enables the application of solder resist in digital additive technology by means of the inkjet process, thus providing Peters Research, in this relatively new segment, with more possibilities in research and process technology, in addition to the conventional coating processes (screen printing, curtain coating and spray coating).
By means of this second inkjet printer, the R&D department of the ink manufacturer from the Lower Rhine is able to simulate projects from industrial customers in their own laboratories, push forward the qualification process and make reliable recommendations. “Its print head is the same, so a laboratory project will also work on industrial printers equipped with several print heads of this type,” says Kevin Poth, ELPEPCB® Project Manager at Peters, describing the benefit of a purchase.
“Thanks to the precise positioning and small droplet volumes, inkjet printing is suitable for a variety of applications, such as printed electronics, printed circuit boards or semi-conductor assembly,” explains service engineer Leon van Lieshout from the Eindhoven-based manufacturer SUSS MicroTec. Among the main features of the Pixdro there is robustness, process control, user-friendliness and precision, says the Dutchman who has just set up the printer at Peters with a team of three engineers.
Electrical properties optimized
The bottom line is that with the solder resist for digital inkjet printing, Peters is highlighting its decades of expertise as a supplier of high-quality electronic coatings, and is now continuing to focus on this new card. By means of the Samba Dimatix print head, the ink is sprayed in the same way as with an inkjet printer and selectively applied to the circuit board. Besides protecting against corrosion and mechanical damage, the solder resist optimises the electrical properties of the PCB. The solder resist has already withstood solder processes without any problems and has therefore already fulfilled its first essential service.
Inkjet printers and the ELPEPCB® solder resists from the Elpejet® IJ 2467 series enable new PCB layouts and interesting resist geometries. By the so-called “digital drop-on-demand” technology, the solder resist is applied selectively. Compared to conventional application methods such as screen printing, spray coating or curtain coating in conjunction with exposure and development steps, the process is simplified and accelerated, which reduces the material consumption significantly.
Project manager Kevin Poth (left) with technical staff from the Dutch subsidiary SUSS MicroTec that developed the SUSS LP50 ‘Pixdro’ printer for research purposes and is now setting it up in the Peters lab (from the right): Application engineer IoannisKawadias, system engineer Maria Tracz, service engineer Leon van Lieshout.
Photos: Peters/Axel Küppers
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.