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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

The Relevance of VeCS as an HDI Process Option

08/20/2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.

Fabrinet Reports Record Q4, FY2026 Revenue Up 36% YoY

08/19/2026 | Fabrinet
Fabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, today announced its financial results for its fourth quarter and fiscal year ended June 26, 2026.

SK hynix Invests 54 Trillion Won in Yongin, Cheongju for AI Memory Demand

08/18/2026 | SK hynix
SK hynix Inc. announced that it has decided to build new fabs in Yongin and Cheongju to respond to the continuously growing demand for memory in the AI era.

Lam Research, NY CREATES Partner to Train Future Semiconductor Workforce

08/12/2026 | PRNewswire
Lam Research Corp. and New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY Creates) announced a collaboration to enable the training of approximately 3,500 students in semiconductor process integration over the next five years.

SpaceX, Tesla Plan Massive Texas Semiconductor Facility to Support AI, Space Technologies

08/07/2026 | I-Connect007 Editorial Team
SpaceX and Tesla have announced plans to build Terafab, a large-scale semiconductor manufacturing facility in Grimes County, Texas, aimed at expanding domestic production of advanced logic and memory devices for artificial intelligence, autonomous vehicles, robotics, and space applications.
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