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Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem

11/06/2024 | SEMI
The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.

Vapor IO Brings NVIDIA AI Aerial to the City of Las Vegas

10/07/2024 | BUSINESS WIRE
Vapor IO, the creators of Zero Gap™ AI, announced today the deployment of the world's first private 5G artificial intelligence radio access network (AI-RAN) powered by the NVIDIA AI Aerial™ platform with Supermicro in Las Vegas.

KLA Completes First Phase of US$200 Million Singapore Operations Expansion

10/04/2024 | KLA
KLA, a world leader in developing industry-leading equipment and services that advance innovation throughout the electronics industry, today celebrated the completion of Phase 1 of its newest manufacturing facility.

NC State CLAWS Hub to Lead $19 Million in ‘Leap Ahead’ Projects

09/25/2024 | NC State University
The White House and U.S. Department of Defense announced today the first year of funding, totaling $19 million, for four additional projects for the Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS) Microelectronics Commons Hub, headed by North Carolina State University.
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