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Ventec International Group Announce Launch of VT-47LT IPC410/126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.

TCT Circuit Supply and Electra Polymers Announce New Strategic Partnership

03/12/2025 | Electra Polymers Ltd
TCT Circuit Supply (TCS) is excited to announce a new strategic partnership with Electra Polymers, a global leader in advanced specialty polymer products

INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates

03/12/2025 | iNEMI
If you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.

Global Sourcing Spotlight: How Global Sourcing Drives Innovation

03/12/2025 | Bob Duke -- Column: Global Sourcing Spotlight
Someone once told me the more you meet and work with people, the more you’ll learn and, most importantly, the more it will spur more innovation. Innovation is, of course, the lifeblood of success. Companies constantly seek ways to stay ahead, remain competitive, and deliver value to their customers.

atg Luther Maelzer to Showcase Latest Generation Large Format Flying Probe Test Systems at IPC APEX EXPO 2025

03/11/2025 | atg Luther & Maelzer
atg Luther Maelzer will showcase their latest technology, the A9L, at the upcoming IPC APEX EXPO.  The A9L will be on display from March 18 – 20 at the Anaheim Convention Center in Booth 3934.
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