Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
American Made Advocacy: New Congress, New Opportunities
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Technical Resources: SMT007 Magazine—February 2025
February 3, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Among their many virtues, an old-fashioned card catalog told you exactly where to find a particular item. Today’s technical resources, while vast and well-catalogued, might not be as easy to find. We don’t have an industry-wide central location for all our resources. Just like each library’s catalog was self-contained, so are today’s technical resources.
No one source has everything you need to know. Yet, you still need to search out individual sources to find potential information. For this issue of SMT007 Magazine, key industry organizations—all with knowledge sharing as a part of their mission—share their technical repositories. Where can you find information critical to your work? Odds are, right here.
Share on:
Suggested Items
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
03/13/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after more than three decades of service to the company and the electronics manufacturing industry.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.
Imagine the Possibilities: Tech Conference 2025
03/05/2025 | Marcy LaRont, I-Connect007As we approach the 25th anniversary of IPC APEX EXPO, excitement buzzes around the annual Technical Program. Coming off a tremendously successful program in 2024—co-hosted with ECWC16 and with a significant global presence—organizers wanted to match that same level of engagement. In this interview, Stan Rak of SF Rak Company and Udo Welzel of Robert Bosch Mobility Electronics, co-chairs of the Technical Program Committee (TPC), highlight efforts of the volunteer committee to bring another quality technical program to life.
2025 IEEE Electronic Components and Technology Conference
03/04/2025 | IEEEMore than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here.