Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

EXTOLL Collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC

02/03/2025 | GlobalFoundries
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.

ElectroCraft Expands Ann Arbor Facility to Strengthen U.S. Manufacturing Independence and Reduce Lead Times

01/31/2025 | PRNewswire
ElectroCraft, a global leader in motor and motion control solutions, proudly announces the significant expansion of its Ann Arbor, Michigan facility.

ElectroCraft Expands Ann Arbor Facility to Strengthen U.S. Manufacturing Independence and Reduce Lead Times

01/30/2025 | PRNewswire
ElectroCraft, a global leader in motor and motion control solutions, proudly announces the significant expansion of its Ann Arbor, Michigan facility.

DuPont Sets the Stage for Electronics Innovation at DesignCon 2025 Expo

01/29/2025 | DuPont
DuPont, a leader in advanced material solutions and technologies, proudly announces its participation at DesignCon 2025 Expo, taking place January 29 - 30 in Santa Clara, California.

Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States

01/28/2025 | Koh Young
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in