It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
3M Joins Consortium to Accelerate Semiconductor Technology in the U.S.
February 4, 2025 | PR NewswireEstimated reading time: 1 minute
3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.
"As the demands of AI and other high performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines." said Steven Vander Louw, 3M's president of display and electronics product platforms. "The companies in the US-JOINT Consortium represent US and Japanese innovation leaders in a range of advanced packaging technologies. 3M is pleased to join the consortium in order to bring our decades of materials science expertise, across more than 50 technology platforms, to help address these challenges."For more than 25 years, 3M has been a supplier of materials and processing aids for semiconductor polishing, advanced packaging, and chip transport applications. Teaming up with industry leaders continues to reinforce 3M's commitment to be an integrated total solutions provider for the semiconductor industry.
The consortium was founded in 2023 and led by Japan-based Resonac, a global leader in the semiconductor and electronics industry.
"We are delighted to welcome 3M to the US-JOINT Consortium," said Hidenori Abe, CTO for semiconductor materials, Resonac. "3M's expertise in materials science and commitment to innovation in advanced packaging device and process solutions will be an asset as we work together to solve difficult technical and integration challenges for customers onshore in the United States."
The new US-JOINT Consortium R&D facility is expected to be unveiled later this year in conjunction with a public launch event.
Share on:
Suggested Items
SEMI ISS Europe 2025 Opens Tomorrow to Highlight AI, Sustainability, and Semiconductor Supply Resilience
03/11/2025 | SEMIThe SEMI Industry Strategy Symposium Europe (ISS Europe) 2025 is set to open tomorrow in Sopot, Poland, bringing together top executives, industry experts, policymakers, and thought leaders to delve into how Europe can leverage AI-driven innovation to enhance its global competitiveness.
European Chips Diversity Alliance Hosts Future Proofing Access to Diverse Talent Event to Strengthen Semiconductor Workforce
03/10/2025 | SEMIThe European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today announced a full-day event on March 27 dedicated to advancing underrepresented groups in the semiconductor industry in collaboration with Learnovate, MIDAS Ireland, and EudaOrg.
SIA Applauds TSMC’s Expanded Investment in U.S. Semiconductor Manufacturing
03/10/2025 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding the announcement this week by C.C. Wei of TSMC and President Trump.
Global Semiconductor Sales Increase 17.9% Year-to-Year in January
03/07/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales hit $56.5 billion during the month of January 2025, an increase of 17.9% compared to the January 2024 total of $47.9 billion and 1.7% less than the December 2024 total of $57.5 billion.
Teradyne Announces Succession Plan for Semiconductor Test Division
03/07/2025 | BUSINESS WIRETeradyne, Inc. announced that Shannon Poulin has joined Teradyne to succeed Rick Burns as President of the Semiconductor Test Division in Q2 2025. Mr. Burns plans to retire on June 1, 2025.