Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

06/04/2026 | Stanton Rak, SF Rak Company
EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

Molex Boosts AI Clusters with Optical Interconnects

03/19/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers.

RTX's Collins Aerospace Initiates Powertrain Testing for Clean Aviation SWITCH Project at the Grid

03/18/2026 | RTX
Collins Aerospace has begun initial testing of the electric motor drive systems for the European Union's Clean Aviation SWITCH project, a key step towards demonstrating the hybrid-electric technology on a full-scale Pratt & Whitney GTF™ engine.

Proper Plane Design Techniques

02/12/2026 | I-Connect007 Editorial Team
Continuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.

Power Integrity: Effective Decoupling Radius

11/26/2025 | Kirk Fabbri, Siemens EDA
Power delivery on modern systems is an important and challenging problem facing hardware designers. These challenges are even more apparent as device operating speeds and current demands increase. Modern FPGAs, processors, and other devices feature fast switching currents and demand precise voltage levels.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in