Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Siemens to Invest €300 Million in Germany to Build Electrical Backbone of Tomorrow’s Industries

07/10/2026 | Siemens
Siemens is investing €300 million to significantly expand the production of key technologies for the global energy transition and for AI data centers. This strategic investment will enable the company to respond to massively increasing demand and further develop its position as a partner to world-leading cloud and AI companies.

Electro Switch Announces David Schmidt as President of the Aerospace & Defense Businesses

07/08/2026 | BUSINESS WIRE
Electro Switch Corp., a leading manufacturer of engineered switches and related components for critical applications in the power, utility, data center, aerospace & defense, and industrial markets, announced today that its Board of Directors has appointed David Schmidt as President of the Aerospace & Defense businesses.

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

06/04/2026 | Stanton Rak, SF Rak Company
EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

Molex Boosts AI Clusters with Optical Interconnects

03/19/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers.

RTX's Collins Aerospace Initiates Powertrain Testing for Clean Aviation SWITCH Project at the Grid

03/18/2026 | RTX
Collins Aerospace has begun initial testing of the electric motor drive systems for the European Union's Clean Aviation SWITCH project, a key step towards demonstrating the hybrid-electric technology on a full-scale Pratt & Whitney GTF™ engine.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in