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Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025

03/17/2025 | Hentec Industries/RPS Automation
The Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).

Vexos Enhances Global Manufacturing Footprint with New Electronics Manufacturing Facility in China

03/13/2025 | EINPresswire.com
Vexos, a leading global provider of Electronic Manufacturing Services (EMS) and Custom Material Solutions (CMS), is pleased to announce the successful relocation of its China operations to a newly opened, state-of-the-art manufacturing facility in Dongguan, China.

EV Solid-State Battery Validation Accelerates in the U.S. and Europe, Mass Production Expected to Gradually Begin by 2026

03/13/2025 | TrendForce
TrendForce’s latest research reveals that solid-state batteries are emerging as the next-generation battery technology with high commercial potential. Manufacturers across the U.S., Europe, and other global markets are accelerating large-scale production development and performance validation for automotive applications. 

Eltek Reports Full Year and Q4 2024 Financial Results

03/13/2025 | Eltek
Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.

YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
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