Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics
February 6, 2025 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026. Designed to enhance the reliability and sustainability of high-temperature electronic assemblies, this reworkable edgebond addresses key industry challenges - rising material costs, operational complexity, and the push for more sustainable manufacturing.
Engineered to meet the demands of advanced electronic applications, ALPHA HiTech CF31-4026 is a game-changer for manufacturers looking to enhance product reliability while reducing material waste and lowering overall costs. Ideal for high-reliability applications in automotive electronics and high-performance computing, this solution ensures components endure extreme conditions without compromise.
“High-reliability electronics require robust solutions that not only perform under extreme temperatures but also support sustainable manufacturing practices,” said Tiang Chuan Hng, Global Product Manager for Polymer Reinforcement Adhesives. “ALPHA HiTech CF31-4026 provides exactly that. Its reworkable nature enables manufacturers to rework components without compromising the integrity of the assembly, promoting both cost-effectiveness and sustainability.”
A Breakthrough for Advanced Electronics Assembly
Electronic devices are becoming increasingly complex, with manufacturers facing significant challenges in ensuring product reliability, particularly in demanding environments. ALPHA HiTech CF31-4026 rises to meet these challenges by delivering exceptional thermal cycling performance, improved adhesion, and superior board-level reliability.
With its innovative reworkable design, ALPHA HiTech CF31-4026 provides manufacturers with greater flexibility. It allows for component removal at lower temperatures, starting from 185°C, enabling quick rework and reducing material waste. This makes it an ideal solution for advanced manufacturing applications where both process efficiency and sustainability are integral.
Key Features:
- Thermal performance: High Tg and low CTE deliver superior thermal cycling durability.
- Reworkable design: Reduces total cost of ownership and supports high-yield manufacturing.
- Exceptional bonding: Provides strong adhesion to PCBs, ensuring reliability in critical applications.
- Slump resistance: Maintains component integrity in dense PCB designs.
Manufacturers seeking to optimize the performance of their high-reliability applications can benefit from ALPHA HiTech CF31-4026’s innovative design, which ensures reliability under the most demanding conditions while also addressing critical sustainability concerns. This next-generation edgebond is set to redefine how manufacturers approach board-level reliability and process efficiency in high-performance electronics.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.