LPMS USA to Offer Live Molding Demos at IPC APEX 2025
February 7, 2025 | LPMS USAEstimated reading time: Less than a minute

LPMS USA, a leader in low pressure molding solutions, is thrilled to exhibit at IPC APEX 2025. Join us at Booth #2300 for live molding demonstrations using the innovative KAPPA 1100H.
Low-pressure molding is an innovative, fast, and efficient process that encapsulates, seals, and protects electronics in a single step. Whether you need to waterproof delicate electronics, overmold cable harnesses, or safeguard LEDs, this process speeds up production, lowers environmental impact, and cuts costs compared to traditional potting methods, all while providing reliable protection for your components.
At the event, we’ll showcase the KAPPA 1100H, a compact, operator-friendly machine that prioritizes safety and ease of use. This machine highlights our commitment to delivering high-quality, reliable solutions tailored to meet the demands of modern electronics manufacturing.
Join us at Booth #2300 to explore how LPMS USA can help you streamline production and protect your products.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Eltek Ltd. Reports Strong Second-Quarter 2025 Results
08/14/2025 | PR NewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the quarter ended June 30, 2025.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.