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Momentus Awarded Expansion of Defense Department Contract for Assembly of Large Structures in Space

02/11/2025 | BUSINESS WIRE
Momentus Inc., a U.S. commercial space company offering satellite buses, technologies, transportation, and other in-space infrastructure services, announced it has been awarded a contract expansion by the U.S. Department of Defense organization, the Defense Advanced Research Projects Agency (DARPA) to conduct an in-orbit demonstration of the assembly of large scale structures.

MBK Partners Consortium to Acquire FICT Limited

02/11/2025 | FICT Limited
MBK Partners , one of the largest independent private equity groups in Asia, is acquiring the outstanding shares of FICT Limited, a global leader in interconnection technology, which includes high-multilayer printed circuit boards and build-up substrates.

nVent SCHROFF Introduces Enhanced PCB Extraction in Rugged Environments

02/11/2025 | I-Connect007 Editorial Team
nVent SCHROFF plc has unveiled its latest innovation, the Positive Retraction Card-Lok, specifically engineered for the dependable removal of printed circuit boards (PCBs) in rugged environments, aerospace being chief among them.

Incap India’s Health Initiatives Support Employee Well-Being

02/11/2025 | Incap
Incap India recently reinforced its commitment to employee wellness with two impactful health-focused events.

Rehm Thermal Systems Brings Pioneering Manufacturing Technologies to productronica China 2025

02/11/2025 | Rehm Thermal Systems
Rehm Thermal Systems will be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.
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