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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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CEE PCB Appoints Markus Voeltz to Business Development Director Europe
February 12, 2025 | CEE PCBEstimated reading time: 1 minute
CEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and will offer local support starting March 2025. With 25 years of experience in the industry, the company is enhancing its commitment to European customers by providing more direct collaboration for technical inquiries and advice.
Markus Voeltz, an experienced sales professional with over 20 years of experience in the PCB/FPC and EMS industries, will head the new European branch. He will be the direct contact for customers and prospects across various industries, offering tailored solutions and support.
CEE PCB is known for its comprehensive product range, which includes multilayer PCBs with up to 30 layers, HDI PCBs, and flexible printed circuits. The company delivers high quality solutions for a wide range of applications, from prototype development to mass production. Notably, CEE PCB is highly flexible and able to handle both small and medium batch sizes efficiently.
The company is certified not only to ISO 9001 but also to the demanding standards of IATF 16949 and ISO 13485, which are particularly important in the automotive and medical technology sectors. These certifications ensure a robust quality management system that meets the highest industrial standards.
The decision to offer direct support in Europe is another step toward serving our customers even faster and more effectively,” says Tom Yang, CEO of CEE “Our long-standing experience and extensive product portfolio, combined with our local presence, allow us to address the specific needs of our customers more directly.”
With this expansion, CEE PCB reinforces its ambitions to strengthen its market position as a reliable partner for PCB and FPC solutions while enhancing its proximity to European customers.
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
05/05/2026 | Green CircuitsThe event, hosted at Peterson Space Force Base, brings together key personnel and mission partners supporting critical U.S. defense and space operations.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.