-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
Inventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Multilayer PCB Market to Reach $116.1B by 2032 at 5.5% CAGR: Allied Market Research
February 12, 2025 | Globe NewswireEstimated reading time: 2 minutes
According to the report, the "multilayer printed circuit board market" was valued at $71 billion in 2023, and is estimated to reach $116.1 billion by 2032, growing at a CAGR of 5.5% from 2024 to 2032.
Prime Determinants of Growth
The multilayer printed circuit board market is expected to witness notable growth owing to increase in demand for electronic devices, surge in industrial automation, and rise in demand for high-speed data transmission. Moreover, increase in investment in healthcare technologies is expected to provide lucrative opportunity for the growth of the market during the forecast period. On the contrary, high initial investment limits the growth of the multilayer printed circuit board market.
The Layer 4 to 6 segment held the highest market share in terms of revenue in 2023.
On the basis of layer, the Layer 4 to 6 segment held the highest market share in 2023, accounting for more than three-fifths of the global multilayer printed circuit board market revenue and is estimated to maintain its leadership status throughout the forecast period, owing its widespread adoption in consumer electronics, including smartphones, tablets, and wearables, due to its optimal balance between performance, cost-effectiveness, and complexity. In addition, its extensive use in automotive systems, industrial equipment, and telecommunication devices further drives demand. However, the Layer 6 and Above segment is projected to manifest the highest CAGR of 7.29 % from 2024 to 2032.
The rigid segment held the highest market share in terms of revenue in 2023.
On the basis of substrate, the rigid segment held the highest market share in 2023, accounting for more than half of the global multilayer printed circuit board market revenue and is estimated to maintain its leadership status throughout the forecast period. However, the Flexible segment is projected to manifest the highest CAGR of 7.05% from 2024 to 2032, owing to the growing demand for lightweight, bendable, and compact electronic devices. This growth is driven by its increasing adoption in wearable electronics, medical devices, and aerospace applications, where flexibility and space-saving designs are critical.
The consumer electronics segment held the highest market share in terms of revenue in 2023.
On the basis of end use industry, the consumer electronics segment held the highest market share in 2023, accounting for more than one-fourth of the global multilayer printed circuit board market revenue and is estimated to maintain its leadership status throughout the forecast period owing to the increasing demand for smartphones, laptops, tablets, and other personal electronic devices, along with advancements in miniaturization and functionality of consumer electronics. However, the healthcare segment is projected to manifest the highest CAGR of 9.31% from 2024 to 2032, owing to the growing integration of advanced electronic components in medical devices such as diagnostic equipment, wearable health monitors, and surgical instruments. The increasing focus on telemedicine, remote patient monitoring, and the adoption of IoT-enabled healthcare solutions further drive the demand for multilayer PCBs in the healthcare sector.
Asia-Pacific held the highest market share in terms of revenue in 2023.
On the basis of the region, Asia-Pacific held the highest market share in terms of revenue in 2023, accounting for more than two-third of the multilayer printed circuit board market revenue owing to the region's strong presence of leading electronic manufacturers, abundant availability of raw materials, and low manufacturing costs. In addition, the rapid growth of industries such as consumer electronics, automotive, and telecommunications in countries like China, Japan, South Korea, and India, coupled with increasing investments in 5G infrastructure and industrial automation, further drives the market growth in this region.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Standardized Hinges and Apple’s Entry Expected to Push Foldable Phone Penetration Beyond 3% by 2027
08/19/2025 | TrendForceTrendForce’s latest investigations reveal that the anticipated launch of Apple’s first foldable device in the second half of 2026 is expected to lift foldable phone penetration from 1.6% in 2025 to over 3% in 2027.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/15/2025 | Marcy LaRont, I-Connect007In our industry, my top reads include Prashant Patel’s overview and argument for reshoring, which I found to be a great general overview and breakdown. In further support of the onshoring/reshoring message, I’m highlighting Nolan Johnson’s interview on the survey and report by the Reshoring Initiative. Check out my interview with USPAE’s Jim Will on the state of the flat panel display (FPD) industry and the risks associated with it for U.S. defense and critical infrastructure products.
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.
Global Excellence in PCB Design: The Global Electronics Association Expands to Italy
08/07/2025 | Global Electronics AssociationIn today's rapidly evolving electronics industry, printed circuit boards (PCBs) serve as the critical backbone influencing the success, reliability, and time-to-market of countless products. Recognizing this essential role, the Global Electronics Association (formerly IPC), a worldwide leader in electronics standards, certification, and education, is now expanding its internationally acclaimed PCB design training to Italy.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.