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Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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iNEMI Shares Resources With Industry
February 12, 2025 | Grace O'Malley, iNEMIEstimated reading time: 1 minute

Since 1996, iNEMI has provided a forum in which its members can leverage their expertise, manpower, and research resources to identify industry needs and efficiently enable new technology development and deployment for high-volume manufacturing. Through almost 30 years of creating technology roadmaps that anticipate future industry needs and conducting timely, high-impact collaborative projects, INEMI has contributed significantly to the industry’s technical knowledge.
Online Knowledge Base
iNEMI has recently launched a new website and we are currently creating an online knowledge base that will make it easier for visitors to find the information they want from iNEMI’s current and archival materials. Although some information is restricted to members, there is also information available to the industry at large. This repository will include webinar presentations and recordings, project reports, white papers and position statements, technical conference papers, contributed articles, and more. In addition to our more recent publications and recordings, it will include iNEMI’s seminal work on such topics as:
- Pb-free alloy alternatives
- Tin whisker mitigation
- Creep corrosion/FOS test
- Low-temperature solder
- Electromigration of SnBi solder
- Value recovery from used electronics
- 5G/mmWave materials characterization
- Warpage characterization for advanced packaging
The iNEMI Knowledge Base is currently under construction and will be available soon. To receive notifications about the latest information available, be sure to create a profile on the new site. If you have a profile, please update it.
To read this entire article, which originally appeared in the February 2025 issue of SMT007 Magazine, click here.
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04/01/2025 | I-Connect007 Editorial TeamIPC APEX EXPO is the largest electronics manufacturing trade show in North America, bringing together professionals from all sectors of the supply chain to educate, network, and share their products and services. We’ve put all our coverage of the show in one easy-to-find location. Just click on “Videos,” “Show Coverage” and “Photos” to find what you’re looking for. Check back regularly as more content is added. You won’t want to miss any of our unique coverage.
Just Because You Can, Doesn’t Mean You Should
03/20/2025 | Tony Plemel, Flexible Circuit TechnologiesDecisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.
Counterfeit Electronics & Materials Symposium Program Announced and Registration Open
03/19/2025 | SMTAThe SMTA is excited to announce the technical program for the Counterfeit Electronics & Materials Symposium. The symposium will be held 15-16 April 2025 at AFC Wimbledon in London, England.
Dana on Data: The Missing AI-NPI Link
03/19/2025 | Dana Korf -- Column: Dana on DataThis year is yielding an extensive amount of communications, conferences, software updates, consultants, and news releases about how generative and re-generative artificial intelligence solutions and large language models are revolutionizing design, all with the intent to reduce new product introduction (NPI) cycle times.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.