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OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment

04/28/2025 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.

Tandem Panel Shipments to Jump Again to 36% in 2026

04/25/2025 | BUSINESS WIRE
According to recent display industry research from Omdia, tandem RGB penetration into the OLED tablet and notebook panel markets surged from almost zero to more than 30% in 2024.

SERMA Microelectronics Expand its Facilities in La Rochelle

04/22/2025 | SERMA Microelectronics
SERMA Microelectronics, a major player in specialized microelectronics, continues its growth with the acquisition of a building adjacent to its current site in La Rochelle.

Hon Hai Research Institute's Fourth-generation Semiconductor Application Reaches a New Milestone

04/21/2025 | Foxconn
Hon Hai Research Institute ( HHRI ) Semiconductor Research Institute has conducted cross-border cooperation with Yang Ming Chiao Tung University and the University of Texas at Austin to invest in forward-looking research on fourth-generation semiconductors.

New High Power 3D AXI for Power Electronics from Test Research, Inc.

04/17/2025 | TRI
Test Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
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