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A Fresh Perspective: Checking in With IPC Student Board Member Waad Tarman
February 17, 2025 | Charlene Gunter du Plessis, IPC Education FoundationEstimated reading time: 1 minute
Waad Tarman is the current IPC Student Board Member and incoming president of the IPC Student Chapter at Auburn University. She has an impressive background as a second-year Ph.D. student and dedicated research assistant at Auburn University’s Electronics Manufacturing and Reliability Laboratory within the Industrial and Systems Engineering Department.
As a Student Board Member, Waad has full voting rights and attends all Board meetings. Her role is focused on bringing a fresh perspective to the table, based on students’ needs and aspirations, as a representative of her fellow IPC student members. Her journey has been defined by a determined pursuit of leadership and a passion for making a positive impact. She possesses strong knowledge of various microelectronics manufacturing, including PCB fabrication and assembly (PCBA), package mounting and assembling (SMT and THMT) technologies, inspection and quality control, and design for manufacturing (DFM).
I visited with Waad last fall after she returned from attending an IPC Board meeting in Munich.
What does it mean to you to serve on the IPC Board of Directors?
Waad Tarman: It is an incredible honor and responsibility to serve on the IPC Board of Directors as the student member. Being the voice of students means ensuring that, in a field that is always changing, our needs and goals are considered. It’s also a unique opportunity to witness how decisions are made at the highest levels of leadership in electronics manufacturing. I have developed a deep understanding for the breadth of knowledge and teamwork needed to overcome industry concerns, and I feel privileged to contribute to these discussions from a student perspective.
Continue reading this article in the Winter 2025 issue of IPC Community.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.