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I-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector.
Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
His new column, “Beyond the Board,” will delve into market and industry trends, workforce engagement, and the processes and technology roadmap within the electronics industry. He will explore a variety of topics, including the future of innovation, electronics and sustainability, how electronics careers are changing the world, breaking stereotypes, and other market trends.
Jesse Vaughan is a third-generation PCB technologist with extensive experience in PCB design, fabrication, assembly, and program management. He has collaborated closely with engineers, manufacturers, and supply chains to deliver high-quality, reliable solutions. Jesse excels at bridging the gap between innovation and manufacturability, optimizing complex board designs, and streamlining production processes. His commitment to advancing PCB technology is evident through his active participation in several IPC committees.
He is currently employed as a senior account manager at Summit Interconnect.
We look forward to Jesse’s insightful contributions and are confident that “Beyond the Board” will become a valuable resource. The first column debuts in the I-Connect007 newsletter MilAero007 Week on Tuesday, Feb. 25.
