Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
I-Connect007 Welcomes New Milaero Columnist Jesse Vaughan
February 18, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector.
Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
His new column, “Beyond the Board,” will delve into market and industry trends, workforce engagement, and the processes and technology roadmap within the electronics industry. He will explore a variety of topics, including the future of innovation, electronics and sustainability, how electronics careers are changing the world, breaking stereotypes, and other market trends.
Jesse Vaughan is a third-generation PCB technologist with extensive experience in PCB design, fabrication, assembly, and program management. He has collaborated closely with engineers, manufacturers, and supply chains to deliver high-quality, reliable solutions. Jesse excels at bridging the gap between innovation and manufacturability, optimizing complex board designs, and streamlining production processes. His commitment to advancing PCB technology is evident through his active participation in several IPC committees.
He is currently employed as a senior account manager at Summit Interconnect.
We look forward to Jesse’s insightful contributions and are confident that “Beyond the Board” will become a valuable resource. The first column debuts in the I-Connect007 newsletter MilAero007 Week on Tuesday, Feb. 25.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rogers Announces Transition of Board Chair and Plans to Add New Independent Director
10/17/2025 | Rogers CorporationRogers Corporation announced that Peter Wallace, Chair of the Board of Directors, has informed the Board of his decision not to stand for re-election at the Company’s 2026 Annual Meeting of Shareholders.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Ibiden Opens Ono Plant to Expand AI Server IC Substrate Production Capacity
10/14/2025 | IBIDENIBIDEN Co., Ltd. announces that it held the opening ceremony for its Ono Plant on October 10, 2025 in Ono Town, Ibi District, Gifu Prefecture. Construction work and preparations for mass production at the plant had been underway.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.