Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Take the Mic: Advanced Encapsulation Process with LPMS USA

03/27/2026 | Real Time with... APEX EXPO
Explore LPMS USA's innovative low pressure molding process for LED circuits, demonstrated by Brian Betti at APEX EXPO 2026. Witness the KAPPA 1100H machine utilizing a low-viscosity polyamide resin to safely encapsulate sensitive components. This professional demonstration highlights advanced manufacturing techniques and the versatility of low-pressure molding for electronic applications.

Sharp Develops Long-Range Video Monitoring Technology

03/26/2026 | Sharp Corporation
Sharp Corporation has developed long-range video monitoring technology which uses AI to analyze and record video streamed from locations 5 to 10 km away.

It’s Only Common Sense: Speed Is a Strategy that Wins Customers

03/23/2026 | Dan Beaulieu -- Column: It's Only Common Sense
After decades in the business, I’ve learned that the companies that win are not always the biggest or the cheapest. They’re not even always the most technically advanced. But they are the fastest. Lest you think they’re sloppy, they’re not. Speed is discipline. It’s intentional and cultural, built into the way a company thinks and moves.

Indium Engineer Examines Key Factors Impacting Improvements in Metal TIMs at TestConX 2026

02/17/2026 | Indium Corporation
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa, Arizona.

LPMS USA and Bostik Announce Joint Technical Webinar on Low Pressure Molding and New Outdoor Electronics Innovation

02/04/2026 | LPMS USA
LPMS USA, a leader in low-pressure molding solutions, is proud to have partnered with Bostik to host a live technical webinar focused on electronic encapsulation using low-pressure molding and the launch of Bostik’s newest outdoor grade material, Thermelt® 964.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in