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J.A.M.E.S. Explores the Future of Additive Manufactured Electronics
February 18, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute
Andreas Salomon is chief scientist at J.A.M.E.S, a joint venture of Nano Dimension and HENSOLD. In this interview he discusses the evolving landscape of additively manufactured electronics, highlighting the integration of cutting-edge technologies, such as micro-dispensing and ink jetting. These technologies enhance capabilities in signal integrity and miniaturization. He also talks about the importance of sustainability, the need for standardized testing, and collaboration among industry leaders that will drive innovation and transform the future of electronics manufacturing through IPC’s standards development.
Marcy LaRont: Andreas, can you tell me about J.A.M.E.S.?
Andreas Salomon: J.A.M.E.S. stands for Jetted Additively Manufactured Electronics Sources. It is a community and network specialized for additively manufactured electronics in all materials, facades, shades, and processes. We are an online collaboration community with more than 11,000 registered users, and these members are truly working magic in printed electronics. This includes innovations from Nano Dimension, using photopolymers and sintered nanoparticle silver ink, advancements in 3D ceramics, or multi-material projects by AMAREA Technology, a startup we support in Dresden making remarkable progress with ceramic materials.
Joining our community is free. We build our success on strong partnerships that drive innovation and help address industry challenges. J.A.M.E.S bridges the gap between industry needs and requirements, connecting materials and process providers with printer manufacturers.
This is not just a small business case or a killer app. We are advancing research that drives real transformation, reshaping the fundamentals of printed circuit board manufacturing. Our work includes acquiring the necessary qualifications and approvals to turn discoveries into viable products for the future.
To read this entire conversation, which appeared in the February 2025 issue of SMT007 Magazine, click here.
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.