Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Preventing Surface Prep Defects and Ensuring Reliability

06/10/2025 | Marcy LaRont, PCB007 Magazine
In printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.

STARTEAM GLOBAL Unveils Innovative Additive Solder Mask Process

06/02/2025 | STARTEAM GLOBAL
STARTEAM GLOBAL, a leading PCB manufacturer, has introduced a revolutionary additive solder mask process at its Flero STARTEAM (FST) factory in Italy, leveraging digital inkjet technology to enhance production efficiency and sustainability.

Real Time with... IPC APEX EXPO 2025: Advancements in Inkjet Technology With Electra Polymers

04/14/2025 | Real Time with...IPC APEX EXPO
Don Monn from Electra Polymers discusses the evolution of inkjet technology since 2016, focusing on market changes and the reliability of inkjet products. He explains the additive inkjet process, which reduces waste and boosts efficiency. The conversation highlights Electra Polymers' strong market presence in North America and the importance of customer trust.

Electra's ElectraJet EMJ110G Powers Seamless Transition at Sunrise Electronics

04/11/2025 | Electra Polymers Ltd
Electra, in partnership with Allen Woods Associates, is proud to announce the successful deployment of its ElectraJet® EMJ110G Soldermask on KLA’s Orbotech Neos™ platform, now running production at Sunrise Electronics in Elk Grove Village, Illinois.

Mycronic Receives Order for an MMX Metrology System

03/03/2025 | Mycronic AB
Mycronic AB (publ) has received an order for an MMX metrology system from an existing customer in Asia. The order value is in the range of USD 2,5-3,5 million. Delivery of the system is planned for the third quarter of 2025.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in