Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Element Solutions Reports Record Quarterly Results and Increases 2026 Full Year Guidance

04/30/2026 | BUSINESS WIRE
Element Solutions Inc, a global and diversified specialty chemicals technology company, announced its financial results for the three months ended March 31, 2026.

StenTech Acquires Pentagon EMS to Further Enhance Tooling Capabilities

04/21/2026 | BUSINESS WIRE
Align Capital Partners’ (ACP) portfolio company StenTech, a leading provider of surface mount technology (SMT) printing solutions, has announced the acquisition of Pentagon EMS.

Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption

04/15/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.

ASMPT Enhances WORKS Monitoring to Boost SMT Production Transparency and Accuracy

04/15/2026 | ASMPT
ASMPT SMT Solutions, the technology and market leader in integrated hardware and software solutions for electronics manufacturing, presents a new version of WORKS Monitoring.

Acron Technologies Acquires Alereon, Expanding Its Advanced Defense Capabilities

04/14/2026 | PRNewswire
Acron Technologies, a portfolio company of TJC, L.P., announced the acquisition of Alereon, Inc., a fabless semiconductor company focused on ultra-wideband (UWB) solutions for the defense electronics market.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in