Flex Expands U.S. Manufacturing Capacity to Meet Customers' Growing AI-Driven Power Demands with New Dallas Facility
February 28, 2025 | FlexEstimated reading time: 1 minute
Flex announced the expansion of its U.S. manufacturing capacity with a new 400,000-square-foot Dallas manufacturing facility focused on power products. Flex's Dallas location significantly boosts production capacity and efficiency for its grid-to-chip data center power infrastructure solutions, including power pods, power distribution units, and low-voltage switchgear. This strategic investment enhances Flex's ability to meet the rising power infrastructure demands driven by AI adoption and reduces production lead times for U.S. customers.
New 400,000-square-foot Dallas manufacturing facility will serve as a hub for Flex's growing customer base.
Flex continues to invest in its capabilities to serve the data center market. Following the acquisition of Crown Technical Systems in October 2024, the new Dallas facility will serve as a central hub, bringing together technical power pod fabrication and assembly with utility-grade capabilities in the U.S., enabling faster and more efficient distribution for its growing North American customer base. Flex has a proven track record of scaling power pod production in EMEA and is leveraging that expertise for its U.S. expansion.
"As AI adoption accelerates, the need for reliable, efficient, and scalable power infrastructure grows," said Chris Butler, President of Embedded and Critical Power at Flex. "Our new Dallas facility positions us to deliver next-generation power infrastructure solutions that help customers maximize computing performance while reducing deployment times. We are committed to tackling the complex power challenges of AI-enabled data centers."
As part of Flex's continued U.S. growth plan, this expansion reinforces the company's dedication to scaling production to meet the increasing domestic demand for power solutions.
Suggested Items
BrainChip Partners with RTX’s Raytheon for AFRL Radar Contract
04/03/2025 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI, today announced that it is partnering with Raytheon Company, an RTX business, to service a contract for $1.8M from the Air Force Research Laboratory on neuromorphic radar signaling.
STMicroelectronics, Innoscience Sign GaN Technology Development and Manufacturing Agreement
04/02/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Innoscience, the world leader in 8” GaN-on-Si (gallium nitride on silicon) high-performance low-cost manufacturing, announce the signature of an agreement on GaN technology development and manufacturing, leveraging the strengths of each company to enhance GaN power solutions and supply chain resilience.
TRI Test Solutions at INNOELECTRO 2025
04/02/2025 | TRIAnytest will join INNOELECTRO 2025, held at BOK Sportcsarnok from April 8 – 10, 2025, to showcase TRI's Test Solution.
Mazda, ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
03/28/2025 | ROHMMazda Motor Corporation and ROHM Co., Ltd. have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.
Electronics in Harsh Environments Conference Program Announced
03/25/2025 | SMTASMTA Europe is proud to announce the 2025 Electronics in Harsh Environments Conference, taking place 20-22 May in Amsterdam, Netherlands. This global conference is a three-day technical event with 27 technical presentations focused on building reliable electronics used in power electronics and harsh environments.