Defense Speak Interpreted: Is There Still a CHIPS Act?
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications
March 3, 2025 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.
Electrical performance optimized for 76-81 GHz automotive radar applications
RO4830 Plus woven glass free, thermoset laminates possess the stable dielectric constant and low insertion loss required by RF designers for millimeter wave automotive radar sensors. The design dielectric constant of RO4830 Plus laminates is approximately 3.03 at 77GHz (microstrip differential phase length method). The combination of Rogers’ new low-loss thermoset resin and very low profile electrodeposited copper foil translates to a very low insertion loss of 1.5 dB/inch for 5mil laminates, as measured by the microstrip differential phase length method.
PCB fabrication characteristics reduce overall PCB manufacturing costs
RO4830 Plus laminates are engineered for the cap layer on FR-4 multi-layer board designs, which are commonly used for 76- 81 GHz automotive radar sensor PCB applications. These thermoset laminates are free of woven glass, contributing to good laser drilling performance, and CAF resistance. RO4830 Plus laminates can be fabricated using standard epoxy/glass (FR-4) processes and are compatible with RO4400™ bond ply. These PFAS-free laminates have the UL-V0 flame retardant rating and are lead free solder process compatible.
RO4830 Plus laminates provide:
- Stable dielectric constant and low insertion loss at 77GHz via Rogers’ new thermoset resin system combined with a very low profile electrodeposited copper (VLP ED).
- New woven-glass-free thermoset material maximizes fabrication yield and efficiency, further reducing the overall cost of PCBs.
Available in dielectric thicknesses of 0.005, Rogers RO4830 Plus laminates are available in standard panel sizes of 24×18 in. (610×457 mm), 24×20 in. (610×508 mm), 24×21in. (610×533 mm) with 0.5 oz. (18 µm) VLP ED.
Share on:
Suggested Items
From DuPont to Qnity: A Bold Move in Electronics Materials
05/14/2025 | Marcy LaRont, I-Connect007DuPont has announced the intended spinoff of a public independent electronics company, Qnity, which will serve as a solutions provider to the semiconductor and electronics industries to enhance competitiveness and innovation in advanced computing, smart technologies, and connectivity. In this interview, Jon Kemp, Qnity CEO-elect and current president of DuPont’s Electronics business, shares his insights on the strategic separation from DuPont.
DuPont Announces Additional Leaders and Company Name for the Intended Spin-Off of the Electronics Business
04/29/2025 | PRNewswireDuPont announced Qnity Electronics, Inc. as the name of the planned independent Electronics public company that will be created through the intended spin-off of its Electronics business.
Real Time with... IPC APEX EXPO 2025: Benmayor Group—Resistance is Futile: Automation Is the Future
04/11/2025 | Real Time with...IPC APEX EXPOJeff Brandman, president of Aismalibar North America, and Eduardo Benmayor, CEO of Benmayor Group, discuss Benmayor Group's role in electronics and automation, focusing on how automation addresses labor shortages. Jeff, notes that many businesses struggle to find workers for manual tasks, emphasizing the need for various automation solutions to boost productivity. North America lags in automation compared to other regions, which impacts efficiency. Jeff recommends a step-by-step approach to scaling automation, and there's growing acceptance of robots in the workforce, leading to a positive outlook for the future.
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates
03/12/2025 | iNEMIIf you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.