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AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Capital Expo & Tech Forum

04/11/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on May 8 at George Mason University – Mason Square in Arlington, Virginia.

Cessna Citation CJ4 Gen3 Ushers in 15 Years of Cutting-Edge Aviation Advancements and Technology

04/10/2025 | BUSINESS WIRE
The Cessna Citation CJ4 business jet family today achieved a milestone anniversary – the 15-year anniversary of certification, entry into service and first delivery of the aircraft. The latest product investment unveiled for the CJ4, the CJ4 Gen3, is expected to enter into service in 2026.

Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2024

04/10/2025 | Gartner, Inc.
Worldwide semiconductor revenue totaled $655.9 billion in 2024, up 21% from $542.1 billion in 2023, according to final results by Gartner, Inc. NVIDIA climbed to the No. 1 position, overtaking Samsung Electronics and Intel for the first time.

AIM Solder and India’s Persang Alloy Industries Announce Strategic Joint Venture

04/10/2025 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 6 at the Crowne Plaza Milwaukee Airport, in Milwaukee, WI. AIM will be showcasing its cutting-edge soldering materials, including Type 5 solder paste offerings.

Real Time with... IPC APEX EXPO 2025: SPEA—Optimizing Testing Processes in PCBA

04/10/2025 | Real Time with...IPC APEX EXPO
Mike Sexton and Dustin Warren of SPEA explore market dynamics for PCBA manufacturers. They emphasize the need for optimizing testing processes, introducing deep In-Circuit Test (ICT) technology that identifies weak components often overlooked by traditional tests. The discussion also covers flying probe technology, highlighting its flexibility for high-mix, low-volume production and comparing it with ICT testing methods.
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