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Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC

05/22/2025 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.

HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%

05/22/2025 | TrendForce
TrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.

Siemens Democratizes AI-driven PCB Design for Small and Medium Electronics Teams

05/21/2025 | Siemens
Siemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS™ Pro Essentials software and Xpedition™ Standard software.

Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design


05/21/2025 | Zuken
Zuken, a global leader in electronic design automation (EDA) solutions, has announced the release of the 2025 updates to its flagship PCB design applications, CR-8000 Design Gateway and Design Force.

Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics

05/20/2025 | Jerome Larez -- Column: Global PCB Connections
In the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.
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