TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
March 13, 2025 | TSMCEstimated reading time: 1 minute
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process. This achievement makes it possible to integrate these two essential components into a system-on-chip (SoC) on an advanced RF process for wireless connectivity products, enabling a significantly smaller form factor while enjoying performance competitive with stand-alone modules.
The smaller area enabled by TSMC’s advanced N6RF+ technology can reduce the size of the wireless connectivity product module by a double-digit percentage. In addition, TSMC and MediaTek’s results showed significant improvement in power efficiency for the PMU compared with existing solutions, while iPA performance was competitive with benchmark products. As the world’s leading supplier of wireless connectivity solutions, MediaTek is well positioned to leverage these advancements to ensure top product performance as it shifts towards the next generation.
A direct result of MediaTek and TSMC’s close collaboration on Design-Technology Co-Optimization (DTCO), MediaTek drew on its product and design expertise to drive system specifications and technology requirements for this project, and TSMC enhanced its technology to enable differentiation in the products.
“After a year of working together on N6RF+, the test chip has exhibited excellent power efficiency gains," said Ching San Wu, Corporate Vice President at MediaTek. "By combining MediaTek's leadership in wireless technology and TSMC's expertise on DTCO, N6RF+ will become a competitive technology for RFSoC projects, creating a significant advantage in the industry."
“Successful DTCO between foundry and customer requires strong mutual trust and teamwork, and we are delighted in this joint accomplishment with a wireless connectivity leader like MediaTek,” said Lipen Yuan, senior director of Advanced Technology Business Development at TSMC. “This achievement on TSMC’s N6RF+ process shows how TSMC combines its leadership in advanced logic and broad portfolio of specialty technologies to provide differentiated solutions for customers’ products.”
Suggested Items
Forge Nano Secures $40M to Scale U.S. Battery Manufacturing and Commercial Semiconductor Equipment Businesses
05/02/2025 | Forge NanoForge Nano, Inc., a technology company pioneering domestic battery and semiconductor innovations, announced the successful close of $40 million in new funding.
MICROOLED Announces Partnership with Vortex Optics and Brand New US Headquarters
05/02/2025 | BUSINESS WIREMICROOLED Inc., the leading global supplier of AMOLED displays, is proud to announce their partnership with Vortex Optics to advance the development of high-performance weapon sights for optical sighting systems.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.