Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025

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Aismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).

Aismalibar will be showcasing cutting-edge thermal management solutions at Booth 338, including new developments in TIMs and thermally conductive PCB laminates for multilayer PCBs and IMS applications. These materials are engineered to optimize heat dissipation, improve dielectric insulation, and enhance the reliability of power electronics systems.

Advanced Thermal Interface Materials (TIMs) for Power Electronics

Aismalibar’s TIM portfolio is designed to address the critical need for efficient thermal transfer while ensuring electrical insulation when required. Our TIM solutions are classified based on dielectric capacity, which is determined by the device’s operating voltage and regulatory insulation requirements. Additionally, Aismalibar has developed self-adhesive and non-adhesive surface treatments to minimize air gaps between the TIM, heatsinks, and electronic components, thereby enhancing thermal transfer efficiency.

Glass-Free Thermally Conductive PCB Dielectric for High-Power Applications

Aismalibar introduces a next-generation, glass-free, thermally conductive dielectric for single-sided and multilayer PCBs. This innovative material provides:

• Thermal conductivity up to 10 W/mK, significantly improving heat dissipation compared to traditional laminates.
• Dielectric thickness options ranging from 50 to 200 microns, ensuring versatility across different PCB configurations.
• High dielectric strength (3 – 10 kV), providing robust electrical insulation without sacrificing thermal efficiency.

By eliminating glass reinforcements, this glass-free bond sheet achieves superior thermal conductivity and mechanical flexibility, making it ideal for power electronics, automotive, and high-reliability applications.

IMS Metal Clad Substrates for High-Power Applications

Aismalibar’s IMS (Insulated Metal Substrate) solutions feature a thick aluminum base, laminated with ED copper foil, providing:

• Superior thermal dissipation, reducing hotspots and improving system longevity.
• High electrical insulation, achieved through Aismalibar’s proprietary polymer-ceramic formulation.
• Compatibility with standard PCB manufacturing processes, enabling seamless integration without additional thermal management components.

Aismalibar’s IMS technology offers a cost-effective, high-performance alternative to conventional heat dissipation solutions, allowing direct SMD assembly and enhanced thermal endurance for automotive, industrial power modules, and LED lighting applications.

Visit Aismalibar at APEC 2025 – Booth 338

We invite PCB design engineers, thermal management specialists, and power electronics professionals to visit Booth 338 to explore our latest advancements in thermally optimized PCB laminates, TIMs, and IMS solutions. Our team will be available to discuss how Aismalibar materials can enhance performance, extend component lifespan, and improve overall system efficiency.