Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
Zhen Ding Reported Its Operating Results for the Full Year of 2024, Expecting AI Applications to Drive Growth in 2025
March 17, 2025 | Zhen Ding TechnologyEstimated reading time: Less than a minute
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, hosted an investor conference and announced its consolidated financial results for the full year of 2024. Revenue for 2024 was NT$171,664 million, reaching a record high in the company’s history and maintaining the company’s position as the world’s largest PCB manufacturer for the eighth consecutive year. The full-year net income was NT$13,096 million, net income to parent was NT$9,180 million, and EPS was NT$9.67.
According to Chairman & Group Chief Strategy Officer (Group CSO) Charles Shen, Zhen Ding’s 2024 revenue increased by 13.4% YoY, exceeding previous expectations and setting a new historical record. The company's global PCB market share further increased from 7.0% in the previous year to 7.3%, and it remains committed to its mid-to-long-term growth strategy. Among Zhen Ding’s four major applications, revenue for Mobile Communications, Servers/Automotive/Optical, and IC Substrates all achieved record highs, while Computers and Consumer Electronics also showed a significant recovery. Benefiting from a better product mix and improved production efficiency, its gross margin for 2024 reached 18.9% and operating margin reached 6.8%, both delivering year-on-year improvements.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.