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2025: A Year Full of Promises for Delvitech

03/19/2025 | Delvitech
As the calendar flips to 2025, Delvitech, a Swiss innovation leader in industrial inspection solutions, is already off to an exceptional start. With numerous accomplishments and significant milestones achieved early in the year, the company has positioned itself for an even brighter future.

IPC’s Call to Action for the EU Competitiveness Compass

03/19/2025 | Nolan Johnson, I-Connect007
The European Union Competitiveness Compass is a strategic roadmap adopted by the European Commission to guide priorities for the next five years. In this interview, Alison James, IPC senior director of Europe government relations, explains how IPC has been proactive in aligning with the roadmap by conducting a study and organizing an electronics industry Call for Action that highlights the need to bolster Europe’s electronics manufacturing base and reduce regulatory and administrative burdens.

New Youth Books Address the Manufacturing Awareness Gap

03/19/2025 | Marcy LaRont, PCB007 Magazine
Mike Nager is a recognized Industry 4.0 thought leader who works to get more STEM learning environments into high schools and colleges. He’s an award-winning author who has written three books on manufacturing for the young audience. Mike is addressing the reality that waiting to create awareness and interest in electronics manufacturing until future workers are young adults is too little, too late.

Jaltek Joins Medilink

03/19/2025 | Jaltek
Jaltek is thrilled to announce that we are now proud members of the Medilink Midlands community, one of the UK’s largest networks of healthcare and life science organisations.

EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI Automated Production Wafer Bonding System

03/18/2025 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveiled the next-generation version of its GEMINI® automated production wafer bonding system for 300-mm wafers.
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