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IPC APEX EXPO 2025: And So It Begins
March 18, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
The IPC APEX EXPO 2025 show floor opens today, but technical, educational, and, of course, standards committee work has been underway during the preceding weekend. In typical spring fashion, the weather has vacillated between sunny and warm to a spot of rain late on Monday afternoon just as many conference goers were headed back to their nearby hotels.
The Anaheim Convention Center has been equally busy with a nearby conference of the American Physics Society, making for an interesting confluence of young and old seeking to learn more about their chosen scientific field. Equally, the APEX EXPO show floor has been abuzz with movers setting up the hundreds of booths as IPC gets ready for a ribbon cutting and keynote speaker to kickoff the week’s activities.
Vendors, suppliers, customers, and decision-makers all have the chance to put all the R&D and standards into practical application.
This year, IPC is celebrating IPC APEX EXPO’s 25th year. Part of the program includes a number of retrospectives and will look back at the show’s early days.
Hot topics already include AI concepts and applications, advanced packaging, ultra HDI, and inter-machine data exchange. Undoubtedly, today’s show events will include a number of announcements related to new products and new programs. We look forward to attending the new Learning Lounge, visiting the IPC Mexico pavilion, learning more about the student posters, and attending the special tech sessions.
Managing editors at I-Connect007 also will be interviewing dozens of industry decision-makers and influencers in our booth for our Real Time with… program. Be sure to stop by and check out the action. While you’re there, pick up material on our book program, and take a selfie with your “electronic wings.” As always, IPC APEX EXPO never disappoints.
Be sure to join us as we cover all the news and events here in Anaheim. We’ll be posting on our website and at www.realtimewith.com.
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Brent Fischthal - Koh YoungSuggested Items
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10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
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10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.