Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Gold as a Key Component in PCBs and IC Substrates
March 20, 2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' AtotechEstimated reading time: 1 minute
Gold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires. Gold plating is a critical step in several finish systems, including electroless nickel/immersion gold (ENIG), electroless nickel/electroless palladium/immersion gold (ENEPIG), and electroless palladium/autocatalytic gold (EPAG). These finishes are valued for their solderability and wire-bondability, with ENEPIG and EPAG offering enhanced solder joint reliability and gold-wire bondability.
This article explores different types of electroless gold plating electrolytes, their plating mechanisms, and their properties and capabilities. We further connect the characteristics of gold to some key challenges of the electronics industry, such as high frequency, signal integrity, and fine feature demands.
The Role of Gold-containing Final Finishes
In the realm of electronics, final finishes play a crucial role. They provide a protective layer on electronic components, preventing oxidation and corrosion that could lead to failures. Without these finishes, the reliability and longevity of electronic devices would be significantly compromised. Final finishes also enhance solderability, ensuring strong and stable connections between components, which is essential for the overall functionality of the device. In summary, final finishes are essential for:
- Protection: Safeguarding components from environmental damage
- Solderability: Ensuring secure and stable connections
- Reliability: Extending the lifespan of electronic devices
The perennial question always will be: Which finish is best for which application? In the dynamic world of electronics manufacturing, the choice of finish is far from trivial—each type has its distinct advantages tailored to specific applications.
Continue reading this article in the March 2025 issue of PCB007 Magazine.
Share on:
Suggested Items
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
Electroninks Acquires Complete UTDots Advanced Materials Nanoinks Portfolio and IP
05/19/2025 | ElectroninksElectroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications.
SAMI-AEC Earns Gold Membership Under 'Made in Saudi' Program
05/19/2025 | SAMI-AECSAMI Advanced Electronics Company (SAMI-AEC) proudly announces its elevation to the prestigious Gold Category within the “Made in Saudi” program.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.