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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Four Industry Leaders Receive IPC President’s Award at IPC APEX EXPO 2025
March 21, 2025 | IPCEstimated reading time: 2 minutes
In recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, four individuals were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, California, on March 18, 2025. Recipients were Xaver Feiner, Zollner Elektronik AG; Thomas Marktscheffel, ASMTPT GmbH; Barry Matties, IPC Publishing Group/I-Connect007; and Cathy Hanlin, Precision Manufacturing Company Inc.
Xaver Feiner is an active member of the IPC Europe Advocacy Group, where he dedicates his time to advancing the position of the electronics industry and the EMS sector across Europe. He has testified before the European Commission to support Europe’s EMS industry. He is also active in IPC’s EMS Leadership Summit, working closely with other EMS leaders to bring improvements and innovation to the manufacturing process.
Thomas Marktscheffel shares his expertise with IPC as a member and leader of several committees and is a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852. Marktscheffel has been involved with IPC standards development since 2015 when he joined the IPC-1782 A-team. He is active on A-teams for IPC-2591, IPC-HERMES-9852, IPC-2551, IPC-2552, and IPC-2553, with the overarching goal of providing standards for Factory of the Future. Currently, Marktscheffel is chair of the IPC 2-10 committee, co-chair of the IPC-2591 CFX Task Group, and chair of several A-teams.
Barry Matties is a leading force in publishing content about the electronics industry. I-Connect007 is the leading online media source for original electronics manufacturing supply chain content. I-Connect007 publishes multiple magazines, newsletters, books, webinars, podcasts, and real-time event coverage. For the past several years, Matties and I-Connect007 have been a valuable media partner for IPC APEX EXPO, dedicating entire issues of its trade magazines to covering the show. During APEX EXPO, I-Connect007 conducts interviews with dozens of industry leaders and multiple IPC staff and publishes them on the RealTime with... IPC APEX EXPO platform. Check out this year's content here.
A posthumous President’s Award was presented to valued industry member, Cathy Hanlin, with Precision Manufacturing Company, Inc. Hanlin was a valued IPC/WHMA committee member whose extensive contributions to standards development are well known. She held leadership roles on 7-31F: IPC WHMA-A-620 Task Group, 7-31FT: IPC WHMA-A-620 Training Committee, 7-31FT-AT: Training Wheelz, and 5-22A- Blue Hedgehog A-Teams.
“The leadership and expertise of Xaver, Thomas, Barry and Cathy have been indispensable to our industry,” said John W. Mitchell, IPC president and CEO. “We were proud to show our appreciation for their significant contributions to IPC and the global electronics industry by presenting them with the IPC President’s Award.”
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Brent Fischthal - Koh YoungSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.