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Four Industry Leaders Receive IPC President’s Award at IPC APEX EXPO 2025
March 21, 2025 | IPCEstimated reading time: 2 minutes
In recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, four individuals were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, California, on March 18, 2025. Recipients were Xaver Feiner, Zollner Elektronik AG; Thomas Marktscheffel, ASMTPT GmbH; Barry Matties, IPC Publishing Group/I-Connect007; and Cathy Hanlin, Precision Manufacturing Company Inc.
Xaver Feiner is an active member of the IPC Europe Advocacy Group, where he dedicates his time to advancing the position of the electronics industry and the EMS sector across Europe. He has testified before the European Commission to support Europe’s EMS industry. He is also active in IPC’s EMS Leadership Summit, working closely with other EMS leaders to bring improvements and innovation to the manufacturing process.
Thomas Marktscheffel shares his expertise with IPC as a member and leader of several committees and is a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852. Marktscheffel has been involved with IPC standards development since 2015 when he joined the IPC-1782 A-team. He is active on A-teams for IPC-2591, IPC-HERMES-9852, IPC-2551, IPC-2552, and IPC-2553, with the overarching goal of providing standards for Factory of the Future. Currently, Marktscheffel is chair of the IPC 2-10 committee, co-chair of the IPC-2591 CFX Task Group, and chair of several A-teams.
Barry Matties is a leading force in publishing content about the electronics industry. I-Connect007 is the leading online media source for original electronics manufacturing supply chain content. I-Connect007 publishes multiple magazines, newsletters, books, webinars, podcasts, and real-time event coverage. For the past several years, Matties and I-Connect007 have been a valuable media partner for IPC APEX EXPO, dedicating entire issues of its trade magazines to covering the show. During APEX EXPO, I-Connect007 conducts interviews with dozens of industry leaders and multiple IPC staff and publishes them on the RealTime with... IPC APEX EXPO platform. Check out this year's content here.
A posthumous President’s Award was presented to valued industry member, Cathy Hanlin, with Precision Manufacturing Company, Inc. Hanlin was a valued IPC/WHMA committee member whose extensive contributions to standards development are well known. She held leadership roles on 7-31F: IPC WHMA-A-620 Task Group, 7-31FT: IPC WHMA-A-620 Training Committee, 7-31FT-AT: Training Wheelz, and 5-22A- Blue Hedgehog A-Teams.
“The leadership and expertise of Xaver, Thomas, Barry and Cathy have been indispensable to our industry,” said John W. Mitchell, IPC president and CEO. “We were proud to show our appreciation for their significant contributions to IPC and the global electronics industry by presenting them with the IPC President’s Award.”
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
                                         Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production It’s Only Common Sense: Your Biggest Competitor Is Complacency
                                         It’s Only Common Sense: Your Biggest Competitor Is Complacency The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
                                         The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible





 
                     
                 
                    