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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Dieter Bergman IPC Fellowship Award Presented to Hiroyuki Watanabe, NEC Corporation, at IPC APEX EXPO 2025
March 24, 2025 | IPCEstimated reading time: 1 minute
The Dieter Bergman IPC Fellowship Award was presented to Hiroyuki Watanabe, NEC Corporation, an IPC Board Member and long-time volunteer, at IPC APEX EXPO 2025 in Anaheim, California. The award is given to members who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts.
A member of the IPC Board of Directors since 2020, Watanabe is an expert in security and international economics. He has presented papers at IPC APEX EXPO, published white papers for the IPC Thought Leaders Program, presented at the IPC Engineering Webinar Series, held individual webinars for members in Japan, and introduced IPC’s initiatives at the Counterfeit Symposium. He serves on the IPC-1792 Cyber Security Standards Committee, is an Asia Task Group member, is an active participant in IPC’s Thought Leadership Program, and is a member of the 2-10-AT3 A-Team, The Strategy Seekers.
As part of the award, Watanabe bestowed the Dieter Bergman Memorial scholarship upon Niigata University in Niigata, Japan.
“Watanabe-San epitomizes the spirit of fellowship of the Dieter Bergman Fellowship Award, in leading and working with committee volunteers from around the world and is a valued board member and industry thought leader,” said John W. Mitchell, IPC president and CEO. “We are fortunate that he has chosen to share his substantial talent and expertise with IPC and the global electronics industry.”
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Brent Fischthal - Koh YoungSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.